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시스템 건전성 및 리스크 관리 연구실

Laboratory for System Health & Risk Management

International Journal

Title
Probabilistic Lifetime Prediction of Electronic Packages Using Advanced Uncertainty Propagation Analysis and Model Calibration
Journal
IEEE Transactions on Components Packaging and Manufacturing Technology
Authors
Hyunseok Oh*, Hsiu-Ping Wei, Bongtae Han*, and Byeng D. Youn
Classification Prognostics & Health Management
Date 2016-02
Citation Index SCIE (IF: 2.2, Rank: 63.1%)
Vol. / Page VOL. 6, NO. 2
File 파일다운로드(2016_IEEE TCMPT.pdf)
Link doi.org/10.1109/TCPMT.2015.2510398
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